Henkel unveils innovative solutions for adhesive technology at 2021 SEMICON China

On March 17, 2021, the 2021 SEMICON China, an industry event for the domestic semiconductor industry, was grandly held in Shanghai. At this exhibition, as an adhesive expert in the semiconductor industry, Henkel focused on showing its advanced packaging technology for systematic packaging, processing technology for internal chip stacking in memory, gallium nitride and silicon carbide technology, and compact camera modules And the smart Electronic material adhesive solution that promotes the bonding of 3D camera modules.

Advanced packaging technology-system-in-package solutions

With the continuous development of emerging industries such as artificial intelligence, autonomous driving, 5G networks, and the Internet of Things, as well as the gradual evolution of mobile electronic products in the direction of lightness, multi-function and low power consumption, the market is concerned about the high performance and small size of chips and electronic products. The demand for high reliability and ultra-low power consumption is also increasing.

Among many packaging technologies, the application requirements of flip chip technology are becoming more and more extensive, and with it comes higher requirements for underfill materials, which must ensure good adhesion between the protective cover or reinforcement and the substrate. , It is necessary to reduce the influence of the warpage of the chip and the package under the thermal load.

To this end, Henkel has introduced LOCTITE ECCOBOND UF 9000AE, a capillary underfill specially designed for flip-chip devices, LOCTITE ABLESTIK CE3920, a protective cover and reinforcement bonding adhesive, as well as power ICs and discrete devices to meet higher requirements. The semi-sintered die attach adhesive LOCTITE ABLESTIK ABP 8068TB12 for heat dissipation needs.

LOCTITE ECCOBOND UF 9000AE has no resin aggregation and filler precipitation after use, and its excellent fast fluidity can achieve higher productivity and lower process costs; LOCTITE ABLESTIK CE3920 has excellent workability, excellent adhesion and high conductivity Performance, can connect the heat sink to the back of the chip without using a protective cover; LOCTITE ABLESTIK ABP 8068TB12 has good sintering performance when used on silver, PPF and gold substrates, no resin overflow, high thermal stability, and electrical stability Well, it can meet higher heat dissipation requirements and realize system-in-package.

Storage device technology-specifically designed for stacked packaging

As one of the three pillars of the semiconductor industry, memory is an important part of semiconductor components, and has played a key role in the design trend and development of electronic products toward light, thin, short, and small. In order to increase the function of the memory chip without increasing the package volume, thinner wafers are used to stack the chips, which increases the performance of electronic products while reducing the volume of the product, which is extremely challenging.

In order to meet the ever-evolving chip stacking requirements, thinner wafers are indispensable, so effective handling and processing of 25μm to 50μm thick wafers becomes very important.

Henkel’s non-conductive die attach film LOCTITE ABLESTIK ATB 100MD8, used in wafer lamination process or as preform decal, is designed for mother-child (multi-layer) chips for stack packaging, stable wafer cutting and chips Picking performance, suitable for thin and large chip applications, can effectively help the production of today’s storage devices.

At the same time, in order to fit the current popular low-power memory device stack packaging, Henkel has launched a non-conductive die attach film LOCTITE ABLESTIK ATB 100DR3, which can have excellent lead penetration wrapping performance in different die attach parameters and has high performance. reliability.

In addition, Henkel’s pre-filled underfill non-conductive film LOCTITE ABLESTIK NCF 200 series is a transparent two-in-one film, which can control a very small amount of glue overflow, and is designed to support compact layout, low-height copper pillars and lead-free , Low K, small pitch, large size and thin flip chip design, can protect the conductive bumps in the TCB process.

Gallium Nitride and Silicon Carbide-High Power Die Bonding Solution

With the promulgation of the “14th Five-Year Plan”, the development of new infrastructure will be carried out in an all-round way. “New infrastructure” is not only connected to the constantly upgrading consumer market, but also to the rapid development of industrial transformation and technological innovation. The development and construction of these industries are closely related to the development of semiconductor technology. The third-generation semiconductor materials represented by gallium nitride and silicon carbide are the core materials supporting “new infrastructure”. These materials have higher band gap, high breakdown voltage, electrical conductivity and thermal conductivity. The fields of, high voltage, high power and high frequency will replace the previous two generations of semiconductor materials. Therefore, it is also more suitable for making high temperature, high frequency, anti-radiation and high power devices. Gallium nitride and silicon carbide materials are widely used in new energy vehicles, radio frequency, charging piles, base station/data center power supplies, industrial control and other fields, and have huge development prospects and market opportunities.

In this field, Henkel has introduced two die attach materials characterized by high reliability and high electrical and thermal conductivity. One is LOCTITE ABLESTIK SSP 2020 all-silver sintered die attach adhesive, which not only has high electrical conductivity and high thermal conductivity. , It also has the characteristics of long online working time and good machinability. The other is Henkel’s new generation of LOCTITE ABLESTIK ABP 8068T series semi-sintered die attach adhesive, which can be connected through sintered metal to ensure the reliability of device operation.

Camera module technology-to achieve higher image quality

With the vigorous development of smart phones, mobile phone cameras have been upgraded from hundreds of thousands of pixels to hundreds of millions of pixels now, and high-definition pixels have also put forward higher requirements for camera assembly. The first thing to bear the brunt is the adhesion requirements for the large-bottom, high-pixel image sensor chip it uses.

In order to solve the problems of chip warpage, lens and lens barrel matching difficulties encountered in the traditional assembly process of large-size image sensors, Henkel has launched a die attach adhesive for large-scale CMOS sensors, which is suitable for fast curing. LOCTITE ABLESTIK ABP 2042AA with flat warpage (-3~3μm) and LOCTITE ABLESTIK ABP 2043 for smile warpage (-4~0μm) after fast curing. For chips of different sizes, lens components with different degrees of warpage can provide warpage performance in different gradient intervals, avoiding problems such as virtual focus and distortion of the lens due to mismatched degrees of warpage. This series of products can achieve the characteristics of curing as low as 95°C in the fastest 3 minutes, effectively alleviating the impact of the thermal process on the overall module, and solving the deformation problem from the source. In addition, good thermal conductivity can also effectively alleviate the “high fever” problem of long-term working of large-size chips.

The camera module contains many parts, such as image sensor, lens holder, lens, circuit board, etc. After many times of assembling, the stacking processing difference is getting bigger and bigger. However, the traditional assembly method cannot freely adjust the influence of these errors, which leads to problems such as virtual focus after the camera is assembled and uneven sharpness of each area.

In order to correct the mechanical difference of each component, the AA (Active Alignment) process, that is, the active alignment process, has become the first choice of manufacturers. Henkel launched a new generation of lens holder adhesives LOCTITE ABLESTIK NCA 2286AD and LOCTITE ABLESTIK NCA 2286AE for active lens alignment. This series of products have high viscosity and thixotropy, so that the glue line has a higher aspect ratio, high adhesion and reliability, so that the final assembly adjustment can be carried out more easily, and it has contributed greatly to the excellent performance of the mobile phone camera.

3D TOF sensor-helping the camera enter the 3D era

With the advancement of technology, people now only need a tablet computer or even a smart phone to realize virtual reality scenes, and no longer need complex collection equipment and high-cost data processing. The key to this technology is the 3D TOF sensor camera module.

Unlike ordinary camera modules, 3D cameras have more new components: such as laser transmitters, diffractive optical elements, and the actual volume of the module is often smaller than that of mainstream cameras. In addition, the laser control chip of the 3D camera module generates a lot of heat in a small area. This requires high thermal conductivity and high reliability die attach adhesives.

Of course, special care needs to be given to new components. Henkel’s LOCTITE ABLESTIK ABP 8068TB die attach adhesive is very suitable for receiving sensors for high thermal conductivity applications on different substrate surfaces. The higher silver content gives it good electrical and thermal conductivity, and has excellent workability and high adhesion. And high reliability, making it very suitable for bonding laser control chips. At the same time, since the inside of the bracket is a closed area, if the heating and curing temperature is too high, the internal air pressure will increase, which will easily cause glue breakage, which makes it possible for foreign materials to enter the camera. In response to this problem, Henkel has launched the LOCTITE ABLESTIK NCA 2370B for bonding to various sensor brackets. Its low-temperature curing feature has excellent adhesion to various substrates, preventing foreign materials from entering the interior, and has high reliability. .

Henkel has more than one hundred years of professional experience in innovative adhesive technology. Relying on innovative ideas, professional technology, global resources, and strong support for localized production and R&D in China, Henkel will continue to uphold the development strategy of “in China” and “for China” to help customers solve challenging problems and actively contribute to Customers in different industries continue to create higher value.

Henkel unveils innovative solutions for adhesive technology at 2021 SEMICON China

Henkel unveils innovative solutions for adhesive technology at 2021 SEMICON China

Henkel unveils innovative solutions for adhesive technology at 2021 SEMICON China

Compact camera module solution to achieve higher image quality

Advanced packaging technology solutions to achieve better system packaging

The Links:   G270QAN010 LM64K837

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